Gold Sputtering Target
Gold Sputtering Target
Material | Gold |
Formula | Au |
Purity | 99.995% |
Typical Substrates | Glass, Silicon, Metal |
Related Materials | Ag, Cu, Pd, Pt Al |
Gold thin films are widely used in research due to their unique properties. Gold has a high electrical and thermal conductivity, making it an excellent choice for electronics, optics, and sensors. Gold is also chemically inert, making it ideal for use in a variety of applications where corrosion resistance is important. Gold is also very malleable and can be easily formed into thin films. Gold thin films are used in research for a variety of applications such as for the fabrication of electrodes for batteries and fuel cells, for plasmonic devices, and for optical coatings.
Gold thin films also have a wide range of commercial applications. They are used in the electronics industry for the manufacture of printed circuit boards, semiconductors, and electronic components. In the optics industry, gold thin films are used to create coatings that improve the performance of optical devices such as lenses and mirrors. Gold thin films are also used in the medical industry for the fabrication of stents and implants. Gold thin films are also used in the automotive industry for the manufacture of catalytic converters.
What substrates are Au thin films typically deposited on
Gold thin films are typically deposited on a substrate such as glass, silicon, or metal. Substrates are chosen based on the desired application and must be carefully chosen to ensure good adhesion of the gold thin film. In order to ensure good adhesion of the gold thin film, a layer of titanium or chromium is often deposited on the substrate prior to the deposition of the gold thin film.
What are the typical properties of gold in thin film
Gold thin films have a high electrical conductivity and are also highly transparent when very thin. Gold thin films can be deposited at a thickness of 5-20 nm and are fairly transparent (80-50%) in this range. Gold thin films also have a high thermal conductivity and can be used to dissipate heat in electronics.
What are the typical deposition conditions for Au thin films
As a conductor, Au can be deposited by both DC and RF sputtering, as well as PLD and evaporation. Below are some common conditions.
DC Sputtering: Power: 50-200 W, Pressure: 1-5 mTorr, Substrate Bias: -50 to -200 V, Distance Target-Sample: 8-10 cm, Substrate Temperature: ~20 degrees Celsius RF
Sputtering: Power: 200-1000 W, Pressure: 5-20 mTorr, Substrate Bias: -50 to -200 V, Distance Target-Sample: 8-10 cm, Substrate Temperature: ~20 degrees Celsius
Pulsed Laser Deposition: Laser Pulse Energy: 1-4 J/cm2, Pressure: 0.1-0.5 mTorr, Distance Target-Sample: ~4-5 cm, Substrate Temperature: ~500-800 degrees Celsius, Argon atmosphere can also be used to slow down the incidence spceies from the plume
Thin film materials related to Au
Other thin film materials related to gold include silver, copper, palladium, platinum, and aluminum. Silver and copper are both excellent electrical conductors and are often used in electronics applications. Palladium and platinum are both highly corrosion-resistant and are used for applications such as fuel cells and catalytic converters. Aluminum is highly reflective and is used for optical coatings and for heat dissipation in electronics.
Research papers about Au thin films
1. “Gold thin films for plasmonic devices” by M.B. Rasch, J.F. Reintjes, and J.C.D. Brand (2012).
2. “Gold thin films for gas sensors” by V.A. Mitin, V.K. Vinokur, and C.M. Sotomayor Torres (2006).
3. “Gold thin films for optical coatings” by V.V. Khardikov, A.V. Gordeev, and A.S. Loktev (2005).
4. “Gold thin films for microelectronics” by R.R. Krieger and A.W. Weimer (2001).
5. “Gold thin films for catalytic applications” by Y.H. Wang and B.S. Hsiao (1996).
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